Effect of annealing temperature on structure of electrodeposited nano-scale copper wires

Y. Ke; T. Konkova; S. Mironov; J. Ohnuki

doi:10.22226/2410-3535-2012-4-198-201

Effect of annealing temperature on structure of electrodeposited nano-scale copper wires

Y. Ke, T. Konkova, S. Mironov, J. Ohnuki

Design, Manufacturing And Engineering Management

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Abstract

High-resolution electron backscatter diffraction (EBSD) technique was employed to investigate structure evolution of electrodeposited and subsequently annealed nano-scale copper wires. The grain structure was found to be stable in the bottom area of a trench during the annealing process. The material was shown to exhibit a large fraction of low-angle boundaries as well as annealing twins.

Original language	English
Pages (from-to)	198-201
Number of pages	3
Journal	Letters on Materials
Volume	2
Issue number	4
DOIs	https://doi.org/10.22226/2410-3535-2012-4-198-201
Publication status	Published - 31 Dec 2012

Keywords

electrodeposition
copper
structure
nano-crystalline
electron backscatter diffraction

Access to Document

10.22226/2410-3535-2012-4-198-201Licence: CC BY 4.0

Ke-etal-LM2012-Structure-of-electrodeposited-nano-scale-copper-wiresFinal published version, 4.02 MBLicence: CC BY 4.0

Cite this

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title = "Effect of annealing temperature on structure of electrodeposited nano-scale copper wires",

abstract = "High-resolution electron backscatter diffraction (EBSD) technique was employed to investigate structure evolution of electrodeposited and subsequently annealed nano-scale copper wires. The grain structure was found to be stable in the bottom area of a trench during the annealing process. The material was shown to exhibit a large fraction of low-angle boundaries as well as annealing twins.",

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author = "Y. Ke and T. Konkova and S. Mironov and J. Ohnuki",

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T1 - Effect of annealing temperature on structure of electrodeposited nano-scale copper wires

AU - Ke, Y.

AU - Konkova, T.

AU - Mironov, S.

AU - Ohnuki, J.

PY - 2012/12/31

Y1 - 2012/12/31

N2 - High-resolution electron backscatter diffraction (EBSD) technique was employed to investigate structure evolution of electrodeposited and subsequently annealed nano-scale copper wires. The grain structure was found to be stable in the bottom area of a trench during the annealing process. The material was shown to exhibit a large fraction of low-angle boundaries as well as annealing twins.

AB - High-resolution electron backscatter diffraction (EBSD) technique was employed to investigate structure evolution of electrodeposited and subsequently annealed nano-scale copper wires. The grain structure was found to be stable in the bottom area of a trench during the annealing process. The material was shown to exhibit a large fraction of low-angle boundaries as well as annealing twins.

KW - electrodeposition

KW - copper

KW - structure

KW - nano-crystalline

KW - electron backscatter diffraction

U2 - 10.22226/2410-3535-2012-4-198-201

DO - 10.22226/2410-3535-2012-4-198-201

M3 - Article

VL - 2

SP - 198

EP - 201

JO - Letters on Materials

JF - Letters on Materials

SN - 2218-5046

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