Spatially dense integration of micron-scale devices from multiple materials on a single chip via transfer-printing

Dimitars Jevtics, Jack A. Smith, John McPhillimy, Benoit Guilhabert, Paul Hill, Charalambos Klitis, Antonio Hurtado, Marc Sorel, Hark Hoe Tan, Chennupati Jagadish, Martin D. Dawson, Michael J. Strain

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The heterogeneous integration of devices from multiple material platforms onto a single chip is demonstrated using a transfer-printing (TP) technique. Serial printing of devices in spatially dense arrangements requires that subsequent processes do not disturb previously printed components, even in the case where the print head is in contact with those devices. In this manuscript we show the deterministic integration of components within a footprint of the order of the device size, including AlGaAs, diamond and GaN waveguide resonators integrated onto a single chip. Serial integration of semiconductor nanowire (NW) using GaAs/AlGaAs and InP lasers is also demonstrated with device to device spacing in the 1 μm range.
Original languageEnglish
Pages (from-to)3567-3576
Number of pages10
JournalOptical Materials Express
Issue number10
Publication statusPublished - 29 Sep 2021


  • transfer printing
  • spatially dense arrangements
  • semiconductor nanowire

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