Structural features of nano-scale damascene copper lines after annealing in wide temperature range

Tatyana N. Konkova, Serge Yu. Mironov, Yiqing Ke, Jin Onuki

Research output: Chapter in Book/Report/Conference proceedingConference contribution book

1 Citation (Scopus)


Grain structure and texture evolved in damascene nano-scale copper lines after annealing in a wide temperature interval of 200°C-500°C were analyzed. Electron backscatter diffraction (EBSD) technique was used for rigorous investigation of the overburden layer, upper and bottom parts of the lines. In all cases, the microstructures were found to stabilize after achieving the same level of total grain-boundary area per unit volume. The grain growth behavior was supposed to be governed by the pinning effect of second-phase particles entrapped during the electrodeposition process.

Original languageEnglish
Title of host publicationProcessing, Materials, and Integration of Damascene and 3D Interconnects 5
EditorsD. Misra
Place of PublicationPennington, NJ
Number of pages8
Publication statusPublished - 4 Apr 2014
Event224th ECS Meeting - Hilton San Francisco, San Francisco, United States
Duration: 27 Oct 20131 Nov 2013

Publication series

NameECS Transactions
PublisherElectrochemical Society
ISSN (Print)1938-5862


Conference224th ECS Meeting
Country/TerritoryUnited States
CitySan Francisco


  • nano-scale damascene copper lines
  • grain structure
  • overburden layer
  • grain-boundary
  • electron backscatter diffraction
  • annealing process
  • thermal stability

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