Structure evolution of electrodeposited nano-scale copper wires during annealing in wide temperature range

T. Konkova, Y. Ke, S. Mironov, J. Onuki

Research output: Contribution to conference › Proceeding › peer-review

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Abstract

[Abstract unavailable]

Original language	English
Number of pages	1
Publication status	Published - 2012
Event	2012 Autumn Meeting of the Japan Institute of Metals - Matsuyama, Japan Duration: 17 Sep 2012 → 19 Sep 2012

Conference	2012 Autumn Meeting of the Japan Institute of Metals
Country/Territory	Japan
City	Matsuyama
Period	17/09/12 → 19/09/12

@conference{628879799c85407b8144d015b0718a98,

title = "Structure evolution of electrodeposited nano-scale copper wires during annealing in wide temperature range",

abstract = "[Abstract unavailable]",

keywords = "nanomaterials, heat treatment, grain boundaries",

author = "T. Konkova and Y. Ke and S. Mironov and J. Onuki",

year = "2012",

language = "English",

note = "2012 Autumn Meeting of the Japan Institute of Metals ; Conference date: 17-09-2012 Through 19-09-2012",

}

TY - CONF

T1 - Structure evolution of electrodeposited nano-scale copper wires during annealing in wide temperature range

AU - Konkova, T.

AU - Ke, Y.

AU - Mironov, S.

AU - Onuki, J.

PY - 2012

Y1 - 2012

N2 - [Abstract unavailable]

AB - [Abstract unavailable]

KW - nanomaterials

KW - heat treatment

KW - grain boundaries

M3 - Proceeding

T2 - 2012 Autumn Meeting of the Japan Institute of Metals

Y2 - 17 September 2012 through 19 September 2012

ER -